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Hybrid liquid metal–water cooling system for heat dissipation of high power density microdevices

✍ Scribed by Yueguang Deng; Jing Liu


Book ID
105925339
Publisher
Springer-Verlag
Year
2010
Tongue
English
Weight
400 KB
Volume
46
Category
Article
ISSN
1432-1181

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✍ Yueguang Deng; Jing Liu 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 465 KB

An active cooling solution using liquid metal as the coolant was proposed for high power light emitting diodes (LEDs). The typical thermal-physical properties of liquid metal were presented. Then a series of experiments under different operation conditions were performed to evaluate the heat dissipa