Humidity acceleration factor for plastic packaged electronic devices

Plastic substrates for thin film electro

Plastic substrates for thin film electronic devices

✍ O.J. Cain 📂 Article 📅 1968 🏛 Elsevier Science 🌐 English ⚖ 771 KB

Bio and Nano Packaging Techniques for El

Bio and Nano Packaging Techniques for Electron Devices || Nano- and Biotechniques for Electronic Device Packaging

✍ Gerlach, Gerald; Wolter, Klaus-Jürgen 📂 Article 📅 2012 🏛 Springer Berlin Heidelberg 🌐 English ⚖ 671 KB

This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a compreh

Bio and Nano Packaging Techniques for El

Bio and Nano Packaging Techniques for Electron Devices || Packaging for Electronic Systems

✍ Gerlach, Gerald; Wolter, Klaus-Jürgen 📂 Article 📅 2012 🏛 Springer Berlin Heidelberg 🌐 English ⚖ 673 KB

This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a compreh

Corrosion criteria for electronic packag

Corrosion criteria for electronic packaging. II. Calculated corrosion currents and acceleration factors

✍ Hoge, C.E. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 665 KB

Study of acceleration factor on moisture

Study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices

✍ T. Wada; Y. Kobayashi; N. Maeda; M. Sugimoto; T. Ajiki 📂 Article 📅 1988 🏛 Elsevier Science 🌐 English ⚖ 321 KB

4950980 Test socket for electronic devic

4950980 Test socket for electronic device packages

✍ WayneK Pfaff 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 89 KB