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How to purchase thick-film equipment and materials : W. Funk. Proceedings, Internepcon 1972. International Electronic Packaging & Production Conference. Brighton, 17–19 October (1972), p. 98

Publisher: Elsevier Science
Year: 1973
Tongue: English
Weight: 110 KB
Volume: 12
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(73)90551-9

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Some experiences in developing methods and machines for a semiconductor mounting operation in a thick-film hybrid facility : G. W. Griffiths. Proceedings Internepcon 1972, International Electronic Packaging & Production Conference, Brighton, 17–19 October (1972), p. 93

📂 Article 📅 1973 🏛 Elsevier Science 🌐 English ⚖ 120 KB