How to improve intrinsic and extrinsic r
โ
Sabine Penka; Susanne Schulte; Markus Czekalla; Jakob Kriz; Martina Hommel
๐
Article
๐
2008
๐
Elsevier Science
๐
English
โ 426 KB
A systematic study of various processes and their impact on intrinsic reliability has been performed on Cu dual damascene interconnects. The most significant improvement for intrinsic reliability is the 'breakthrough' liner. A strong impact on stressmigration (SM) was revealed using a HDP based SiN