Hot spot analysis during thermal shutdown of SOI BCDMOS half bridge driver for automotive applications

✍ Scribed by Heer, M.; Grombach, P.; Heid, A.; Pogany, D.

• Book ID: 108210772
• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 811 KB
• Volume: 48
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2008.07.009