Horizontal die cracking as a yield and reliability problem in integrated circuit devices : Yehya M. Kasem and Leo G. Feinstein. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 654 (1987)

• Book ID: 103286461
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 125 KB
• Volume: 29
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(89)90378-8