✦ LIBER ✦
Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects
- Book ID
- 121427465
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 237 KB
- Volume
- 102
- Category
- Article
- ISSN
- 0026-0576
No coin nor oath required. For personal study only.