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Hole Mobility and Thermal Velocity Enhancement for Uniaxial Stress in Si up to 4 GPa

✍ Scribed by Xiao-Feng Fan; Leonard Franklin Register; Brian Winstead; Mark C. Foisy; Wanqiang Chen; Xin Zheng; Bahniman Ghosh; Sanjay K. Banerjee


Book ID
114618576
Publisher
IEEE
Year
2007
Tongue
English
Weight
529 KB
Volume
54
Category
Article
ISSN
0018-9383

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