High-Thermal-Conductivity AlN Filler for Polymer/Ceramics Composites
โ Scribed by Shoichi Kume; Ikuko Yamada; Koji Watari; Isao Harada; Kenshi Mitsuishi
- Book ID
- 109262116
- Publisher
- John Wiley and Sons
- Year
- 2009
- Tongue
- English
- Weight
- 477 KB
- Volume
- 92
- Category
- Article
- ISSN
- 0002-7820
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Most polymeric tribological components are inherently insulative, resulting in susceptibility to failure from frictional heating at the PV limit, which is typically reported as a product of the heat flux terms pressure (P) and sliding speed (V). This letter reports on the design of a tribological co
## Abstract Thermally conductive resins are needed for bipolar plates in fuel cells. Currently, the materials used for these bipolar plates often contain a single type of graphite in a thermosetting resin. In this study, varying amounts of four different types of polyacrylonitrile carbon fillers (K