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High-temperature electrical conductivity and thermal decomposition of Sylgard® 184 and mixtures containing hollow microspherical fillers

✍ Scribed by R. T. Johnson Jr.; R. M. Biefeld; J. A. Sayre


Publisher
Society for Plastic Engineers
Year
1984
Tongue
English
Weight
688 KB
Volume
24
Category
Article
ISSN
0032-3888

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