High temperature crack growth in copper under cyclic loading conditions
โ Scribed by Kim, Young-Suk; Nix, W.D.
- Book ID
- 122829278
- Publisher
- Elsevier Science
- Year
- 1990
- Weight
- 532 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0956-716X
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