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High temperature adhesives for structural applications - a review

โœ Scribed by J.R. Fowler


Publisher
Elsevier Science
Year
1982
Weight
517 KB
Volume
3
Category
Article
ISSN
0261-3069

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Characterization of reworkable high-temp
โœ C. P. Wong; Jiali Wu; Randy T. Pike ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 229 KB

The need to have a high-temperature adhesive that can withstand temperatures in excess of 350ยฐC for MCM-D silicon substrate process application, yet which can be reworkable at slightly high temperature ฯณ 400ยฐC for the removal from the glass pallet, is important. A novel, reworkable, high-temperature