๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

High Tc thin film and device development

โœ Scribed by Betts, K.; Burbank, M.B.; Cragg, A.; Fife, A.A.; Kubik, P.R.; Lee, S.; McCubbin, J.; McKenzie, D.; Tillotson, M.; Taylor, B.; Tran, H.; Vrba, J.; Chaklader, A.C.D.; Roemer, G.; Heinrich, B.; Chrzanowski, J.; Irwin, J.C.


Book ID
114549824
Publisher
IEEE
Year
1989
Tongue
English
Weight
487 KB
Volume
25
Category
Article
ISSN
0018-9464

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


High-Tc superconducting thin films
โœ Dr. Shintaro Miyazawa; Dr. Yasuo Tazoh; Hidefumi Asano; Dr. Yasuhiro Nagai; Dr. ๐Ÿ“‚ Article ๐Ÿ“… 1993 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 871 KB

This review describes recent advances in thin film studies of high-T, superconducting cuprates. Emphasis is placed on epitaxial thin film growth technologies for LnBa,Cu,O, (Ln = Y, Eu) cuprates, and on microwave device applications. An exciting area of this research involves epitaxial multilayer st

Dissipation in high Tc thin films
โœ England, P.; Venkatesan, T.; Cheeks, T.L.; Craighead, H.G.; Rogers, C.T.; Chan, ๐Ÿ“‚ Article ๐Ÿ“… 1989 ๐Ÿ› IEEE ๐ŸŒ English โš– 366 KB
Coupled heat transfer and thermal stress
โœ B. Gu; P.E. Phelan; S. Mei ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 322 KB

A coupled heat transfer and thermal stress analysis is developed for a thin-film high-T c superconductor device. The thermal boundary resistance between the film and substrate, which is modelled as a function of interfacial peeling stress, is used to couple the structural and thermal sides of the mo