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High Strength Lead-Free Composite Solder Materials using Nano Al2O3 as Reinforcement

✍ Scribed by X. Zhong; M. Gupta

Publisher
John Wiley and Sons
Year
2005
Tongue
English
Weight
517 KB
Volume
7
Category
Article
ISSN
1438-1656

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✦ Synopsis

High strength light weight lead‐free composite solder materials containing varying amount of nano‐alumina particulates were synthesized by powder metallurgy process employing different extrusion temperatures. The presence of nano Al~2~O~3~ particulates not only enhanced strength and improved dimensional stability but also reduced the weight of the solder alloy matrix. Fairly uniform distribution of the nano‐alumina particulates was observed in the composites.

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