This patent describes a seal structure which has a seal member integrally formed on a flexible wiring board without peeling out an insulating layer on the wiring board. The seal is directly
โฆ LIBER โฆ
High-pressure tie-back receptacle and seal assembly
- Book ID
- 121919003
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- English
- Weight
- 135 KB
- Volume
- 2013
- Category
- Article
- ISSN
- 1350-4789
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