Springer Series in Optical Sciences 128......Page 1
High Power Diode Lasers......Page 3
Contents......Page 5
1 Introduction. Reinhart Poprawe......Page 7
2.1. Principles of Diode Laser Operation......Page 11
2.2. Manufacturing Technology......Page 31
2.3. Chip Characterization Methods and Measurements......Page 39
2.4. Broad Area Emitters and Arrays......Page 53
2.5. High-Brightness Emitters and Arrays......Page 61
3.1. Introduction......Page 81
3.2. Mounting of Diode Laser Bars......Page 83
3.3. Cooling......Page 89
3.4. Expansion-Matched Packages......Page 110
3.5. Mounting of Micro-Optics......Page 123
4.1. Introduction and Survey......Page 127
4.2. Beam Collimation......Page 134
4.3. Techniques for Beam Combination......Page 148
4.4. Stacking Techniques......Page 156
4.5. Beam Symmetrization and Fiber Coupling......Page 168
4.6. Beam Quality Limits and Comparison to Coherent Coupling......Page 181
5.1. Introduction......Page 187
5.2. Theoretical Background of Beam Propagation......Page 189
5.3. Power Density Distribution......Page 192
5.4. Propagation of the BeamWidths......Page 194
5.6. Measurement of the Power Density Distribution and the Beam Propagation Ratio, M2......Page 202
5.7. Beam Positional Stability......Page 210
5.8. Wavefront of a Laser Beam......Page 211
5.9. Lifetime......Page 212
5.10. Laser Safety......Page 215
5.11. Table of International Standards related to Laser Metrology......Page 216
5.12. Practical Hints for Measurements......Page 217
6.2. Multi-Purpose Diode Laser Systems......Page 221
6.3. Modular Diode Laser Systems......Page 251
7.1. Joining Technologies......Page 291
7.2. Cutting and Laser-Assisted Machining Technologies......Page 393
7.3. Surface Treatment......Page 431
8 Summary and Outlook. Reinhart Poprawe......Page 541
Index......Page 545