High-performance semiconductor optical amplifier array for self-aligned packaging using Si V-groove flip-chip technique

✍ Scribed by Leclerc, D.; Brosson, P.; Pommereau, F.; Ngo, R.; Doussiere, P.; Mallecot, F.; Gavignet, P.; Wamsler, I.; Laube, G.; Hunziker, W.; Vogt, W.; Melchior, H.

• Book ID: 119784730
• Publisher: IEEE
• Year: 1995
• Tongue: English
• Weight: 282 KB
• Volume: 7
• Category: Article
• ISSN: 1041-1135
• DOI: 10.1109/68.384515