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High-Performance Low-Cost 10-Gb/s Coaxial DFB Laser Module Packaging by Conventional TO-Can Materials and Processes

✍ Scribed by Tien-Tsorng Shih; Min-Ching Lin; Wood-Hi Cheng


Book ID
114570231
Publisher
IEEE
Year
2006
Tongue
English
Weight
514 KB
Volume
12
Category
Article
ISSN
1077-260X

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