✦ LIBER ✦
High heat load properties of actively cooled W/CuCrZr mock-ups by diffusion bonding with Ni or Ti interlayer
✍ Scribed by Jun Li; Jian-Feng Yang; Jun-Ling Chen
- Book ID
- 116496970
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 400 KB
- Volume
- 86
- Category
- Article
- ISSN
- 0920-3796
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