✦ LIBER ✦
High-frequency simulations and compact models compared with measurements for passive on-chip components
✍ Scribed by Peter Meuris; Gabriela Ciuprina; Ehrenfried Seebacher
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 341 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0894-3370
- DOI
- 10.1002/jnm.569
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✦ Synopsis
Dedicated on-chip passive test structures to test the quality of high-frequency simulations and compact models are described. Based upon the simulations a compact (SPICE) model is calculated. The paper shows the quantitative correlation between measurements and simulations for a resistor, a coplanar line and a metal insulator metal capacitor. Agreement of less than 10% is obtained between measurements and simulations.