✦ LIBER ✦
High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits
✍ Scribed by Lueck, M.R.; Reed, J.D.; Gregory, C.W.; Huffman, A.; Lannon, J.M.; Temple, D.S.
- Book ID
- 114620978
- Publisher
- IEEE
- Year
- 2012
- Tongue
- English
- Weight
- 710 KB
- Volume
- 59
- Category
- Article
- ISSN
- 0018-9383
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