High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

✍ Scribed by G. Druais; G. Dilliway; P. Fischer; E. Guidotti; O. Lühn; A. Radisic; S. Zahraoui

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 942 KB
• Volume: 85
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2008.06.004