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Heterogeneous Multicore Processor Technologies for Embedded Systems

✍ Scribed by Kunio Uchiyama, Fumio Arakawa, Hironori Kasahara, Tohru Nojiri, Hideyuki Noda, Yasuhiro Tawara, Akio Idehara, Kenichi Iwata, Hiroaki Shikano (auth.)


Publisher
Springer-Verlag New York
Year
2012
Tongue
English
Leaves
233
Edition
1
Category
Library

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✦ Synopsis


To satisfy the higher requirements of digitally converged embedded systems, this book describes heterogeneous multicore technology that uses various kinds of low-power embedded processor cores on a single chip. With this technology, heterogeneous parallelism can be implemented on an SoC, and greater flexibility and superior performance per watt can then be achieved. This book defines the heterogeneous multicore architecture and explains in detail several embedded processor cores including CPU cores and special-purpose processor cores that achieve highly arithmetic-level parallelism. The authors developed three multicore chips (called RP-1, RP-2, and RP-X) according to the defined architecture with the introduced processor cores. The chip implementations, software environments, and applications running on the chips are also explained in the book.

  • Provides readers an overview and practical discussion of heterogeneous multicore technologies from both a hardware and software point of view;
  • Discusses a new, high-performance and energy efficient approach to designing SoCs for digitally converged, embedded systems;
  • Covers hardware issues such as architecture and chip implementation, as well as software issues such as compilers, operating systems, and application programs;
  • Describes three chips developed according to the defined heterogeneous multicore architecture, including chip implementations, software environments, and working applications.

✦ Table of Contents


Front Matter....Pages i-xi
Background....Pages 1-9
Heterogeneous Multicore Architecture....Pages 11-18
Processor Cores....Pages 19-122
Chip Implementations....Pages 123-151
Software Environments....Pages 153-177
Application Programs and Systems....Pages 179-218
Back Matter....Pages 219-224

✦ Subjects


Circuits and Systems; Computer-Aided Engineering (CAD, CAE) and Design


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