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Heat transfer at the metal/substrate interface during solidification of Pb-Sn solder alloys

✍ Scribed by K. Narayan Prabhu; S. T. Kumar; N. Venkataraman


Book ID
111786154
Publisher
Springer US
Year
2002
Tongue
English
Weight
372 KB
Volume
11
Category
Article
ISSN
1059-9495

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