Heat-resistant adhesive resins derived from bismaleimides and bisnadimides containing amide linkages

✍ Scribed by John A. Mikroyannidis; Anastasios P. Melissaris

• Book ID: 102734777
• Publisher: John Wiley and Sons
• Year: 1989
• Tongue: English
• Weight: 750 KB
• Volume: 37
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.1989.070370911