✦ LIBER ✦
Heat dissipation of printed circuit board by the high thermal conductivity of photo-imageable solder resist
✍ Scribed by Seunghyun Cho; Joseph Y. Lee
- Book ID
- 111857081
- Publisher
- The Korean Institute of Metals and Materials
- Year
- 2010
- Tongue
- English
- Weight
- 450 KB
- Volume
- 6
- Category
- Article
- ISSN
- 1738-8090
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