<p>The Handbook of Electronics Packaging Design and Engineering has been writΒ ten as a reference source for use in the packaging design of electronics equipΒ ment. It is designed to provide a single convenient source for the solution of reΒ curring design problems. The primary consideration of any
Handbook of Electronic Package Design
β Scribed by Pecht, Michael
- Publisher
- Chapman and Hall/CRC
- Year
- 2018
- Tongue
- English
- Leaves
- 892
- Series
- Mechanical Engineering Ser
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Table of Contents
Content: Cover
Half Title
Title Page
Copyright Page
Dedication
Table of Contents
Preface
Contributors
1: Introduction
2: Electronic Components
3: Printed Wiring Board Design and Fabrication
4: Electronic Assemblies
5: Interconnections and Connectors
6: Layout
7: Thermal Design Analysis
8: Thermomechanical Analysis and Design
9: Design for Vibration and Shock
10: Humidity and Corrosion Analysis and Design
11: Design for Reliability
12: Electronic Materials and Properties
Appendix A: Acronyms Used in Electronics
Appendix B: Glossary of Hybrid Microcircuits Packaging Terms. Appendix C: Standards and Specifications for MicroelectronicsAppendix D: Standards and Specifications for PCBs and PWBs
Appendix E: Unit Conversion Tables
Index.
π SIMILAR VOLUMES
<p>The Handbook of Electronics Packaging Design and Engineering has been writΒ ten as a reference source for use in the packaging design of electronics equipΒ ment. It is designed to provide a single convenient source for the solution of reΒ curring design problems. The primary consideration of any
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and
This book is a highly recommended reference for all mechanical (and, I suppose, some electrical) engineers working on packaging. The book covers many topics with enough detail so that the engineer may have a good holistic understanding of everything from: - pcb design, layout and fabrication - compo
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and