Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil

✍ Scribed by Tae Won Lee; In Kyum Kim; Chi Hwan Lee; Jong Hoon Kim

• Book ID: 110238718
• Publisher: Springer
• Year: 1999
• Tongue: English
• Weight: 425 KB
• Volume: 18
• Category: Article
• ISSN: 0261-8028
• DOI: 10.1023/a:1006616502733