✦ LIBER ✦

Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMs

✍ Scribed by Ki-Don Kim; Jongbae Park; Jae-Gon Lee; Joungho Kim; Jeong-Hae Lee

Book ID: 102519150
Publisher: John Wiley and Sons
Year: 2005
Tongue: English
Weight: 136 KB
Volume: 45
Category: Article
ISSN: 0895-2477
DOI: 10.1002/mop.20878

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✦ Synopsis

In this paper, we propose structures for noise-coupling reduction between adjacent packages and dense multichip modules (MCMs), which are classified as (i) grounded-moating and (ii) shielding structures, and (iii) a combination of them. Good agreement from a 3D finite-element method (3D-FEM) electromagnetic characterization and experimental verification of each structure are presented.

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