✦ LIBER ✦
Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding
✍ Scribed by S Murali; N Srikanth; Charles J Vath III
- Book ID
- 114340901
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 631 KB
- Volume
- 50
- Category
- Article
- ISSN
- 1044-5803
No coin nor oath required. For personal study only.