Grain-boundary structure of oxygen-free high-conductivity (OFHC) copper subjected to severe plastic deformation and annealing

✍ Scribed by D.R. Waryoba; P.N. Kalu; R. Crooks

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 446 KB
• Volume: 494
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2007.09.083