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Grain Boundary Resistivity and Electrically Induced Grain Boundary Migration (EIGM) in Metallic Bamboo Microstructures

✍ Scribed by Rand Dannenberg; Alexander H. King

Book ID: 110267558
Publisher: Springer
Year: 1999
Tongue: English
Weight: 115 KB
Volume: 7
Category: Article
ISSN: 0927-7056
DOI: 10.1023/a:1008778113938

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