Grain-boundary diffusion creep in nanocrystalline palladium by molecular-dynamics simulation
β Scribed by V. Yamakov; D. Wolf; S.R. Phillpot; H. Gleiter
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 349 KB
- Volume
- 50
- Category
- Article
- ISSN
- 1359-6454
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β¦ Synopsis
Molecular-dynamics (MD) simulations of fully three-dimensional (3D), model nanocrystalline face-centered cubic metal microstructures are used to study grain-boundary (GB) diffusion creep, one mechanism considered to contribute to the deformation of nanocrystalline materials. To overcome the well-known limitations associated with the relatively short time interval used in our MD simulation (typically Ο½10 Οͺ8 s), our simulations are performed at elevated temperatures where the distinct effects of GB diffusion are clearly identifiable. In order to prevent grain growth and thus to enable steady-state diffusion creep to be observed, our input microstructures were tailored to (1) have a uniform grain shape and a uniform grain size of nm dimensions and (2) contain only high-energy GBs which are known to exhibit rather fast, liquid-like self-diffusion. Our simulations reveal that under relatively high tensile stresses these microstructures, indeed, exhibit steady-state diffusion creep that is homogeneous, with a strain rate that agrees quantitatively with that given by the Coble-creep formula. The grain-size scaling of the Coble creep is found to decrease from d Οͺ3 to d Οͺ2 when the grain diameter becomes of the order of the GB width. For the first time a direct observation of the grainboundary sliding as an accommodation mechanism for the Coble creep, known as Lifshitz sliding, is reported.
π SIMILAR VOLUMES
Residual strain in metals is typically considered to be irreversible. However, residual strain in nanocrystalline materials can be recovered over a period of time via diffusive mechanisms. In this study, free-standing copper films of submicron thickness with an average grain size of about 40 nm are