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Grain boundaries in granular materials—A fundamental limit for thermal stability

✍ Scribed by Saharan, L.; Morrison, C.; Ikeda, Y.; Takano, K.; Miles, J. J.; Thomson, T.; Schrefl, T.; Hrkac, G.

Book ID
120179050
Publisher
American Institute of Physics
Year
2013
Tongue
English
Weight
877 KB
Volume
102
Category
Article
ISSN
0003-6951

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As an attempt to understand the temperature and strain-rate dependence of strength in nanocrystalline and ultrafine-grained materials, thermally activated depinning process has been incorporated into a dislocation bow-out model from a grain boundary. Such quantities as activation energy, activation