Geophysicists, 3-D integrated studies, and the future

3D, SF and the future

✍ Birtchnell, Thomas; Urry, John 📂 Article 📅 2013 🏛 Elsevier Science 🌐 English ⚖ 336 KB

The future of 3D video

✍ Ollis, M.; Williamson, T. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 399 KB

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Hybrid Integral Equation Modeling Methods for 3D Integration

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 606 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || 2.5D Simulation Method for 3D Integrated Systems

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 982 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Macromodeling of Complex Interconnects in 3D Integration

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 715 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Modeling of Through-Silicon Vias (TSV) in 3D Integration

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 326 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a