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Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials

✍ Scribed by Sarawut Rimdusit; Hatsuo Ishida


Publisher
Springer-Verlag
Year
2002
Tongue
English
Weight
178 KB
Volume
41
Category
Article
ISSN
0035-4511

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