GaAs IC symposium preview
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 345 KB
- Volume
- 4
- Category
- Article
- ISSN
- 0961-1290
No coin nor oath required. For personal study only.
β¦ Synopsis
GaAs IC Symposium preview
in the year since the last Symposium in New Orleans, the GaAs industry has made quantum leaps in manufacturing technology and volume applications. Details of those strides make the 1991 Symposium in Monterey look extra attractive to designers, engineers, managers,, etc. in fact everyone interested in powerful new tools for their next-generation bag of tricks.
A
ggressive systems integrators such as AT&T, Convex and Cray Computers, Motorola and Rockwell in the US; Fujitsu, NEC and Toshiba in Japan; and Continental Microwave, Marconi-Plessey, Philips and Thompson in Europe, have joined the traditional R&D oriented attendees, and all will be present at this year's Symposium October 20-23rd in Monterey, CA with success stories to share and exciting new areas to mutually explare. These companies have each made significant corporate commitments to individualized blendings of our varied menu of compound semiconductor technologies, and the results are commercial orders. They will be looking critically at one another, but they'll also be looking to the researchers and developers for a prognosis of what might be their best bets for 1992 and beyond.
Step by step, the GaAs IC Symposium forum progressively appeals to a wider variety of high performance users. Some want microwave, some want digital, but more and more users need a blending of the two, a trend some have been predicting for years.
This year marks the offΓcial mainstreaming of a struggling, but always promising, high performance technology, whose time in the sun has finally arrived.
π SIMILAR VOLUMES
Over the past 17 years the Symposium has been the preeminent international forum on the most recent advancements in ICs using GaAs, InP, and other compound semiconductor materials. Coverage embraces all aspects of the technology including materials issues, device fabrication, IC design and testing,