In this book leading profesionals in the semiconductor microelectronics field discuss the future evolution of their profession. The following are some of the questions discussed:<ul><li>Does CMOS technology have a real problem?<li>Do transistors have to be smaller or just better and made of better m
Future trends in microelectronics. journey into the unknown
โ Scribed by Luryi, Serge; Xu, Jimmy; Zaslavsky, Alex
- Publisher
- John Wiley & Sons
- Year
- 2016
- Tongue
- English
- Leaves
- 360
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
The book presents the future developments and innovations in the developing field of microelectronics. The bookโs chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities.
โฆ Table of Contents
Content: Cover
Title Page
Copyright
Contents
List of Contributors
Preface
Acknowledgments
Part I Future of Digital Silicon
1.1 Prospects of Future Si Technologies in the Data-Driven World
1. Introduction
2. Memory --
DRAM
3. Memory --
NAND
4. Logic technology
5. CMOS image sensors
6. Packaging technology 7. Silicon photonics technology 8. Concluding remarks
Acknowledgments
References
1.2 How Lithography Enables Moore's Law
1. Introduction
2. Moore's Law and the contribution of lithography
3. Lithography technology: past and present
4. Lithography technology: future
5. Summary 6. Conclusion Acknowledgments
References
1.3 What Happened to Post-CMOS?
1. Introduction
2. General constraints on speed and energy
3. Guidelines for success
4. Benchmarking and examples
5. Discussion
6. Conclusion
Acknowledgments
References 1.4 Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices1. Introduction
2. FEOL technology and materials for 3D integration
3. Integration of ""more than Moore"" functionality
4. Implications of 3D integration at the system level
5. Conclusion
Acknowledgments
References 1.5 Challenges to Ultralow-Power Semiconductor Device Operation1. Introduction
2. Ultimate MOS transistors
3. Small slope switches
4. Conclusion
Acknowledgments
References
1.6 A Universal Nonvolatile Processing Environment
1. Introduction
2. Universal nonvolatile processing environment
โฆ Subjects
Microelectronics;Technological innovations;Nanotechnology;Technological innovations;Semiconductors;Technological innovations;TECHNOLOGY & ENGINEERING;Mechanical;TECHNOLOGY & ENGINEERING;Mechanical
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