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Future high temperature applications for SiC integrated circuits

✍ Scribed by Carl-Mikael Zetterling; Luigia Lanni; Reza Ghandi; B. Gunnar Malm; Mikael Östling


Book ID
112182445
Publisher
John Wiley and Sons
Year
2012
Tongue
English
Weight
409 KB
Volume
9
Category
Article
ISSN
1862-6351

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We have studied the formation of metal/ceramic joints by solid state bonding technique for applications at temperatures >600 • C. The bonding is obtained between silicon carbide (SiC) and Ni-based super-alloy (HAYNES ® 214 TM ) via metallic foils (Ni, Ag). In some cases a thin coating on the ceramic