𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Fundamental rules for implementing and wiring of IC packages

✍ Scribed by J. Kawasaki; H. Endo

Book ID
112080079
Publisher
John Wiley and Sons
Year
1972
Tongue
English
Weight
965 KB
Volume
92
Category
Article
ISSN
0424-7760

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Wire density in CAE analysis of high pin
Wire density in CAE analysis of high pin-count IC packages: Simulation and verification
✍ W.R. Jong; Y.R. Chen; T.H. Kuo πŸ“‚ Article πŸ“… 2005 πŸ› Elsevier Science 🌐 English βš– 907 KB

Wire sweep has been recognized as one of the major defects in the encapsulation of microelectronic chips by the transfer molding process. As thinner and denser IC packages emerge, wire-sweep analysis becomes more challenging and troublesome. This paper studies the reactive flow in IC encapsulation