Functionally graded materials by electrochemical processing and infiltration: application to tungsten/copper composites

✍ Scribed by R. Jedamzik; A. Neubrand; J. Rödel

• Book ID: 111536489
• Publisher: Springer
• Year: 2000
• Tongue: English
• Weight: 990 KB
• Volume: 35
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1023/a:1004735904984