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Fracture toughness of superplastic formed/diffusion bonded interfaces

โœ Scribed by Y. Xiang; S. Wu; D. Chen

Book ID
111786024
Publisher
Springer US
Year
2001
Tongue
English
Weight
65 KB
Volume
10
Category
Article
ISSN
1059-9495

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The fracture toughness of an epoxy-based film adhesive has been investigated using Mode I and combined Mode 1 + Mode II loadings. The opening Mode, Mode I, was realized by employing the Tapered Double Cantilever Beam (TDCB) specimen, while the mixed opening and shear modes, Mode I + Mode II, resulte