The fracture toughness of an epoxy-based film adhesive has been investigated using Mode I and combined Mode 1 + Mode II loadings. The opening Mode, Mode I, was realized by employing the Tapered Double Cantilever Beam (TDCB) specimen, while the mixed opening and shear modes, Mode I + Mode II, resulte
โฆ LIBER โฆ
Fracture Toughness Measurement of Adhesively Bonded Joints at Cryogenic Temperatures
โ Scribed by Yoon, Soon Ho ;Kim, Jin Gyu ;Hwang, Yun Jeong ;Lee, Dai Gil
- Book ID
- 126542908
- Publisher
- Taylor and Francis Group
- Year
- 2012
- Tongue
- English
- Weight
- 965 KB
- Volume
- 26
- Category
- Article
- ISSN
- 0169-4243
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