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Formation of intermetallics and grain boundary diffusion in Cu-Al and Au-Al thin film couples

✍ Scribed by J.M. Vandenberg; F.J.A. Den Broeder; R.A. Hamm

Book ID: 107864081
Publisher: Elsevier Science
Year: 1982
Tongue: English
Weight: 182 KB
Volume: 93
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(82)90133-x

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