✦ LIBER ✦
Formation of Cu-Sn Alloy Layer by Contact Deposition Using Quaternary Ammonium-Imide-Type Ionic Liquid
✍ Scribed by Katase, Takuma; Kurosaki, Ryoichi; Murase, Kuniaki; Hirato, Tetsuji; Awakura, Yasuhiro
- Book ID
- 121656755
- Publisher
- The Electrochemical Society
- Year
- 2006
- Tongue
- English
- Weight
- 680 KB
- Volume
- 9
- Category
- Article
- ISSN
- 1099-0062
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