Reactive ion etch processes for modern interlevel dielectrics become more and more complex, especially for further scaling of interconnect dimensions. The materials will be damaged within such processes with the result of an increase in their dielectric constants. The capability of selected additive
✦ LIBER ✦
Formation of a nitrogen—carbon bond from N2 and CO. Influence of MgCl2 on the N2 reduction process in the system TiCl4/Mg
✍ Scribed by Piotr Sobota; Zofia Janas
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 427 KB
- Volume
- 276
- Category
- Article
- ISSN
- 0022-328X
No coin nor oath required. For personal study only.
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