✦ LIBER ✦
Formation of 100 μm Deep Vertical Pores in Si Wafers by Wet Etching and Cu Electrodeposition
✍ Scribed by Lee, Chia-Lung; Tsuru, Shinsuke; Kanda, Yuji; Ikeda, Shigeru; Matsumura, Michio
- Book ID
- 126153936
- Publisher
- The Electrochemical Society
- Year
- 2009
- Tongue
- English
- Weight
- 406 KB
- Volume
- 156
- Category
- Article
- ISSN
- 0013-4651
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