Formation behavior of different topographies of crack growth path under high and low cyclic stresses in ultrafine-grained copper

✍ Scribed by M. Goto; K. Kamil; S.Z. Han; K. Euh; Y. Yokoho; S.S. Kim

• Book ID: 113899327
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 556 KB
• Volume: 66
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2011.11.030