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Formation and relative stability of interstitial solid solutions at interfaces in metal matrix composites

✍ Scribed by Simon Dorfman; David Fuks


Book ID
104314121
Publisher
Elsevier Science
Year
1997
Weight
102 KB
Volume
18
Category
Article
ISSN
0261-3069

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✦ Synopsis


On the example of Cu-C composite material the way to calculate the occupation of the interstitial positions and its temperature dependence is shown. The results obtained on the basis of non-empirical calculations indicate the preferable occupation of octahedral positions up to T ; 1200 K. This confirms the structure of the interstitial solid solution. Within this model the influence of the alloying on the height of the diffusion barrier and on the temperature dependence of carbon diffusion in copper is calculated.


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