This special issue contains 19 papers selected from the proceedings of the 5th ESIS TC4 1 Conference on the ''Fracture of Polymers, Composites and Adhesives", held in Les Diablerets, Switzerland between 7th and 11th September 2008. The conference was chaired by Professor J.G. Williams and was attended by over 120 international delegates. Thirty nine oral papers were presented in a single technical session over three days in addition to a strong poster session. The theme of the conference, and this special issue, reflects the main activities of the technical committee which are focussed on developing fracture mechanics test methods for polymers, adhesive joints and composites.
As always, the delamination of composites has remained a popular research theme with the effects of mode II, mode mix and fatigue loading all being represented in this special issue. The recent interest within the committee in developing cutting and scratching tests on polymers to derive fracture properties is reflected by three papers on this theme. The essential work of fracture method has remained popular and papers on the environmental and creep resistance of polymers are also included. In the area of adhesion and adhesives, the evaluation of interfacial toughness and the effects of test rate in structural adhesive joints are both included.
This special issue is sourced from selected papers presented at the conference. All papers have been peer reviewed and the Editorial Team (drawn from the Conference Committee) have jointly co-ordinated this process. I hope that you enjoy reading them and are inspired to participate in the future technical activities of ESIS TC4.